TSMC Introduces 32nm Process Technology, Moves to 45nm Process for Collaboration with NXP
December 14, 2007
Taiwan's TSMC announced on December 11 that it has developed the 32nm process technology that supports both analog and digital IC functionality. The company presented the technology at the IEDM (International Electron Devices Meeting) in Washington, DC. Furthermore, the company stated that it had verified the full functionality of the 2Mbit SRAM (Static Random Access Memory) test chip with the smallest 32nm bit cell.
In related news, NXP announced on December 12 that the company's cooperation with TSMC has migrated to the 45nm process, with production scheduled to begin in 2008. The technology will initially be applied in chips for use in mobile phones and mobile TV. For future cooperation with TSMC, NXP plans to place more emphasis on the development of CMOS (Complementary Metal-Oxide-Semiconductor) technology, according to Taiwan's Economic Daily News.